Plate grinder

Equipment flow:

In plate grinding plate (1) - Inspection - grinding plate (2) - Inspection - flushing sewage - pressure washing - ultrasonic washing - high pressure washing - Di washing - dry board combination - board out

Equipment specification:

External dimension of the equipment: 9680mm (L) * 2387mm (W) * 2500 ± 25mm (H) (the production rate is roughly proportional to the length of the equipment)

PCB board specification: I) 610 mm * 610 mm []

II) 300 mm * 300 mm [small]

III) 0.2-3.2 mm [thickness] [standard: 55 wheelbase]

IV) 0.1-3.2 mm [thickness] [customized: 35 wheelbase]

Production speed: 0.6-5 M / min (adjustable) [preset working yield: 1.5 m / min]

Equipment features:
1. Shock absorbing structure and material design are adopted to effectively reduce vibration during operation;,
2. Automatic sensing plate thickness, automatic pressure adjustment function, ceramic grinding brush can be selected, the thin plate grinding is 0.1 mm;
3. It is widely used in plug hole, resin removal, through-hole plate and surface treatment after copper plating. It is an indispensable equipment in HDI process.